Reducing laser induced stress to enable tightly packed structures in glass fabricated with selective laser etching

verfasst von

A. Günther, N. Jacob, W. Kowalsky, B. Roth

Abstract

Selective laser etching (SLE) is a promising subtractive manufacturing technology enabling highly precise 3-dimensional structuring to create integrated optical structures in glass. The process itself is based on two main steps. First, the designed structure is transferred into the glass by a fs-pulsed laser. Subsequently, the glass is placed in a corresponding lye or acid, respectively, to remove the structured areas from the bulk glass. Hereby, the choice of the liquid used of for etching step depends on the glass material to be structured. Previous studies showed that the surface quality which can be achieved with SLE is sufficient for optical applications if the right process parameters are chosen. The process itself induces stress inside the material which limits the distance between single structures inside the glass. In this work, we investigated the laser parameters affecting the applied stress as well as the effect of a subsequent annealing step before and after etching. The possibility to minimize the distance between multiple structures enables the fabrication of highly packed photonic and opto-fluidic chips, i.e. for sensing application.

Organisationseinheit(en)

PhoenixD: Simulation, Fabrikation und Anwendung optischer Systeme
Hannoversches Zentrum für Optische Technologien (HOT)

Externe Organisation(en)

Technische Universität Braunschweig

Typ

Aufsatz in Konferenzband

Anzahl der Seiten

5

Publikationsdatum

19.03.2025

Publikationsstatus

Veröffentlicht

Peer-reviewed

Ja

ASJC Scopus Sachgebiete

Elektronische, optische und magnetische Materialien, Physik der kondensierten Materie, Angewandte Informatik, Angewandte Mathematik, Elektrotechnik und Elektronik

Elektronische Version(en)

https://doi.org/10.1117/12.3042947 (Zugang: Geschlossen)